Wire Bonding Transducer Oscillation

This video demonstrates a software analysis of the wire bonder transducer oscillation during wire bonding.

Transducer suspension without tilt motion guarantees true vertical wedge tool at any time during processing. In addition, a sensor integrated into the transducer allows Process Integrated Quality Control (PiQC™) on Hesse & Knipps wire bonders which captures multi-dimensional signal analyses of the bond process. PiQC calculates a bond quality index value in real time, using significant signals from the wire-bonding process.

RELATED LINKS:

PiQC™ Process Integrated Quality Control for wire bonders

PiQC article

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