Wire Bonding Transducer Oscillation
This video demonstrates a software analysis of the wire bonder transducer oscillation during wire bonding.
Transducer suspension without tilt motion guarantees true vertical wedge tool at any time during processing. In addition, a sensor integrated into the transducer allows Process Integrated Quality Control (PiQC™) on Hesse & Knipps wire bonders which captures multi-dimensional signal analyses of the bond process. PiQC calculates a bond quality index value in real time, using significant signals from the wire-bonding process.
Welcome! You must be registered and logged in to access all of the content on this site.
If you have already registered, be sure you are logged in.Click Here to Log In.
If you have not yet registered, please click here to Register.