Lee Levine to present “Wedge Bonding New Wire Alloys for Medical Electronics”

Fremont, CA, September 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, will present “Wedge Bonding New Wire Alloys for Medical Electronics” at The Eighth Annual MEPTEC Medical Technology Conference taking place September 17-18, 2013 at Arizona State University in Tempe, Arizona. 

Lee Levine, distinguished member of the technical staff with Hesse Mechatronics, will present during Session 5 on Wednesday, September 18 at 11:00 AM at the Old Main building on the campus of Arizona State University.

Wedge bonding, because of its smaller bond size, room temperature bonding, lowest loop capabilities and low cost is the best interconnect method for the latest medical devices. Mr. Levine’s discussion will focus on the use of fine pitch wedge bonding for medical electronic interconnections.           

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com.  For more information on Hesse Mechatronics’ training and applications support services, please e-mail info@hesse-mechatronics.us. To see wire bonding in action, visit www.wirebonddemo.com.

About Hesse Mechatronics

Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

For more information, please visit the company’s website at www.hesse-mechatronics.com.

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