Published online in “Charged – Electric Vehicles Magazine“; Author: Mike McKeown, Sr. Business Development Manager at Hesse Mechatronics All electronic devices need to be connected electrically (and mechanically) and there are numerous ways of completing this task. Wire bonding is one type of interconnection. There are three types of wire bonding: thermocompression, thermosonic and ultrasonic. WeRead the full article…
Hesse Mechatronics mentioned in the article of “Charged: Electric Vehicles Magazine”, March/April 2016 A closer look at wire bonding (by Christian Ruoff) Prior to writing his article addressing the future of battery bonding, author Christian Ruoff talked to wire bonding experts of Hesse Mechatronics (Mike McKeown, Dr. Michael Brökelmann, Dr. Matthias Hunstig, Dr. Dirk Siepe) aboutRead the full article…
Fremont, California, December 15, 2015 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that the company recently partnered with CAD Design Software. The Hesse Mechatronics Utility Module creates an XML data file thatRead the full article…
Fremont, California, November 2015 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that the company recently partnered with North Carolina State University to develop packaging of wide bandgap (WBG) power devices. Hesse Mechatronics, inRead the full article…
Fremont, California, April 2015 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Kristian Oftebro recently joined the company as Senior Process Development Engineer. Kristian brings over fifteen years of wire bonding experienceRead the full article…
President Obama declares 2014 a year of action A consortium of 18 companies and 6 universities are partnering with the US government to strengthen US manufacturing. Hesse Mechatronics will provide valuable wedge bonding process knowledge and equipment to the consortium. Proposed in the President’s latest State of the Union address, The Next Generation Power ElectronicsRead the full article…
Paderborn, Germany, March 2014 – Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently appointed Dr.-Ing. Dirk Siepe as Head of Process Technology and Dipl.-Ing. Mehmet Akcit as Sales Manager for Europe. Dr. Siepe will strengthen Hesse GmbH’s position as a wireRead the full article…
APEC 2014, the Applied Power Electronics Conference and Exposition takes place March 16-20 in Forth Worth, Texas Fremont, CA, February 2014 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces three days of heavyRead the full article…
Hesse Mechatronics Japan Co. Ltd. to open new office Fremont, CA, February 2014 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Jiro Hashizume recently joined the company to head up itsRead the full article…
HTMG to support wire bonding equipment sales in RF, automotive and power electronics markets Fremont, CA, January 2014 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, recently announced that it has appointed HTMG asRead the full article…
