Fremont, Calif., Aug 2012 – Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales thatRead the full article…
Hesse Mechatronics Inc. Appoints New Technical Training Manager Fremont, Calif., July 2012 – Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, has appointed Allan Camp as Technical Training Manager. Allan will provide technical training on Hesse’s family of semiconductor packaging equipment including high speed fine pitch wedge bonders and heavy wire bonders. TrainingRead the full article…
Fremont, CA, May 29, 2012 – Hesse GmbH, European headquarters of Hesse Mechatronics Inc. and sister company to Americas subsidiary Hesse, will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications”at the rescheduled SMTA Philadelphia Chapter Meeting now on June 12th at 4:30 p.m. at the Air Products in Allentown, PA. The SMTA meeting willRead the full article…
Fremont, CA, May 10, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, will discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive MicroelectronicsRead the full article…
Fremont, CA, April 25, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, will present “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Dinner Meeting on May 9th at 4:30 p.m. Camden, New Jersey. InRead the full article…
Fremont, CA, February 15, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout theRead the full article…
Fremont, CA, January 25, 2011 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will discuss “Why Wedge Bond?” versus ball bonding in satisfying fine pitch and thin package requirements as one ofRead the full article…
Fremont, CA, January 16, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will discuss “Wedge Bonding for RF and Microwave Devices” at the Advanced Technology Workshop and Tabletop Exhibition on RF andRead the full article…
Heavy Wire Bonder Features Support Power Electronics Requirements Fremont, CA, January 6, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will demo its next generation BONDJET BJ939 Heavy Wire Bonder at theRead the full article…
Fremont, CA, October 2011 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, announces that it will present an IMAPS webinar, “Why Wedge Bond,” taking place on November 10, 2011 from 12pm – 1pm. The cost is $25 for IMAPSRead the full article…
