Fremont, CA, January 25, 2011 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will discuss  “Why Wedge Bond?” versus ball bonding in satisfying fine pitch and thin package requirements as one of  the IPC Online Education: 2012 Winter Webinars scheduled for January 31, 2012 at 10 a.m. CT.

Wire bonding is an ultrasonic welding process accomplished by deforming the wire and the substrate together, forming an alloy of the two. Wedge bonding, because it directly deforms the wire without first forming a ball, is capable of producing a bond with minimum deformation and extremely low loop heights. High quality wedge bonds can produce deformation just 20-25% larger than the wire diameter, whereas typical ball bonds are 1.8-2 times the wire diameter.

Attendees of “Why Wedge Bond” will come away with practical knowledge of the advantages of wedge bonding over ball bonding as a reliable alternative that is capable of handling future requirements for bonding thin packages and ultra-fine pitch devices.

Click here for more information and registration.  For more information on wedge bonders, please visit Hesse website.

About Hesse Mechatronics

Hesse GmbH, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.