Four Hesse Mechatronics labs focused on wire bonding process technology now open across the country

 

Fremont, CA, August 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently opened its newest training and applications lab in Tempe, Arizona. 

 

The new training and applications lab is located at 6105 S. Ash Avenue, Suite A-1, Tempe, AZ 85283. Customers can reach staff at the new facility by calling the company’s main number at (408) 436-9300. The company has appointed Allan Camp, who joined the company as technical support manager in June 2012, responsibility for the new lab.

 

Allan’s role and the new lab are additional steps in Hesse Mechatronics’ strategy to improve customers experience and convenience in qualifying and learning about the company’s wedge bonding equipment and taking advantage of support services. The company also maintains west coast and east coast demonstration and applications labs in Fremont and Anaheim, California and Clinton, Massachusetts.

 

Allan will oversee technical support and training on Hesse Mechatronics’ family of semiconductor packaging equipment both at the new training facility and at customer sites. He will also conduct demonstrations of Hesse Mechatronics' wedge bonding equipment, including thin wire wedge bonders and heavy wire wedge bonders, so customers can validate and qualify wedge bonding equipment prior to making an investment in new technology.

 

Allan possesses more than two decades of experience in the semiconductor industry, including Eastman Kodak Company in microelectronics packaging and Xerox Corporation in wafer fabrication.

 

“Allan’s knowledge in wafer fab operations, microelectronics packaging and semiconductor process equipment will serve our customers well as he provides training that addresses their specific equipment and manufacturing requirements,” notes Joseph S. Bubel, president of Hesse Mechatronics, Inc.  

 

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com.  For more information on Hesse Mechatronics’ training and applications support services, please e-mail info@hesse-mechatronics.us. To see wire bonding in action, visit www.wirebonddemo.com.

 

About Hesse Mechatronics

 

Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

 

For more information, please visit the company’s website at www.hesse-mechatronics.com.