Heavy Wire Bonder Features Support Power Electronics Requirements

Fremont, CA, February 13, 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will demo its next generation BONDJET BJ93X Heavy Wire Bonder in BOOTH #123 at APEC 2013 (The Applied Power Electronics Conference and Exposition) taking place March 18-20, 2013 in Long Beach, CA.

The BONDJET BJ93x Heavy Wire Bonders feature a heavy wire bond head with integrated pull test and large table travel (305 mm x 410 mm) that meets automotive electronics and power semiconductor requirements.

“The BONDJET BJ93x Heavy Wire Bonders provide the large current carrying capacity and high reliability that power electronics manufacturers demand,” states Joseph S. Bubel, Managing Director of Hesse Mechatronics, Inc. “They are also the fastest heavy wire bonders available today.”

The BONDJET BJ93x Heavy Wire Bonders handle aluminum, gold and copper heavy round wire and ribbon wire at speeds of 3 wires/sec. Patented PiQC Process Integrated Quality Control analyzes 5 critical measurements of bond quality in real time for every bond, ensuring that only reliable, high quality devices are produced.

APEC attendees can learn more about BONDJET BJ93x Heavy Wire Bonder capabilities at the Hesse Mechatronics booth – number 123. To schedule a private demo, contact Hesse Mechatronics at 408-436-9300 or info@hesse-mechatronics.us.  Product information is also available at www.hesse-mechatronics.com and heavy wire bonding videos are available at www.wirebonddemo.com.

About Hesse Mechatronics

Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

For more information, please visit the company’s website at www.hesse-mechatronics.com.

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