Fremont, CA, February 2014 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces three days of heavy wire and ribbon bonding demonstrations on the BondJet BJ935 Fully Automatic Heavy Wire Bonder at APEC 2014. Demos will take place Monday, March 17 through Wednesday, March 19 at booth #222 at the Fort Worth Convention Center. 

 

Hesse Mechatronics will demonstrate heavy wire and ribbon bonding technology as follows:

 

To schedule a demo during APEC, or at one of Hesse Mechatronics’ demonstration labs, please email info@hesse-mechatronics.us.

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com.  

 

For more information on Hesse Mechatronics’ training and applications support services, please e-mail info@hesse-mechatronics.us. To see wire bonding in action, visit www.wirebonddemo.com. 

 

About Hesse Mechatronics

Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

 

For more information, please visit the company’s website at www.hesse-mechatronics.com.