San Jose, Calif., June 2011 – Hesse Mechatronics, Inc., a subsidiary of Hesse GmbH – leading manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry – will give a technical presentation on wire bonding at the IMAPS ATW on High Reliability Microelectronics for Medical and Hi-Rel Devices taking place June 14-15, 2011 in Minneapolis, Minnesota (www.imaps.org/medical).

Written and presented by Lee Levine of Process Solutions Consulting (www.processsolutionsconsulting.com) on behalf of Hesse’s, the presentation entitled “Why Wedge Bond?” sheds light on the limitations of ball bonding and the potential of wedge bonding to dominate the market as the method of choice for ultra fine pitch and high reliability device interconnection. The presentation takes place during Session II: Microelectronics and Applications, 1:30 – 1:45 on Wednesday, June 14, 2011 at the Crowne Plaza Minneapolis Northstar Downtown.

“This presentation is a great fit for the medical electronics engineers who will attend this meeting,” said Joseph S. Bubel, president of Hesse Mechatronics, Inc. “One of the key features on our wedge bonders that is critical for medical electronics is Process Integrated Quality Control (PiQC). PiQC is a multi-dimensional process control system that monitors all significant bonding process values to judge wire bond quality, redefining quality control standards, especially for customers with stringent or increasing quality demands such as those involved in medical electronics.”

The extended abstract for “Why Wedge Bond?” is available for download at www.wirebonddemo.com/tech/whywedgebond