Jiro Hashizume Joins Hesse Mechatronics as Country Manager for Japan
Hesse Mechatronics Japan Co. Ltd. to open new office
Fremont, CA, February 2014 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Jiro Hashizume recently joined the company to head up its new subsidiary, Hesse Mechatronics Japan Co., Ltd.
Mr. Hashizume has 17 years of experience in technical support, software design and sales management in the semiconductor equipment industry. For the past five years he served as territory manager for Japan and Korea for Kulicke & Soffa Industries, Inc. (K&S), where he gained extensive understanding of pre- and post-sales technical support, marketing and sales strategies to grow wire bonding equipment sales. Prior to his time at K&S, Mr. Hashizume worked for Orthodyne Electronics as senior field applications engineer and NEC Machinery Corporation as control system engineer.
“Jiro’s extensive experience with wire bonding equipment for the automotive, industrial power and semiconductor device industries provides a solid base for growing our business in Japan,” said Joseph S. Bubel president of Hesse Mechatronics, Inc. “Jiro’s sales and marketing expertise combined with his solid wire bonding equipment technical knowledge will greatly benefit our customers and we are thrilled to have him as a member of our Team..”
Mr. Bubel will expand his role as president for Hesse Mechatronics’ Americas subsidiary, to also oversee management of the new Japanese subsidiary. Customers may contact Mr. Hashizume by email at jiro.hashizume@hesse-mechatronics.jp. The company anticipates opening its new office in Japan later this year..
For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com. For more information on Hesse Mechatronics’ training and applications support services, please e-mail info@hesse-mechatronics.us. To see wire bonding in action, visit www.wirebonddemo.com.
About Hesse Mechatronics
Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.
For more information, please visit the company’s website at www.hesse-mechatronics.com.
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