Fremont, California, April 2015 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Kristian Oftebro recently joined the company as Senior Process Development Engineer.

Kristian brings over fifteen years of wire bonding experience to Hesse Mechatronics. Prior to joining Hesse Mechatronics, Kristian worked for Kulicke and Soffa and Orthodyne where he started in the Field Service Department prior to spending the majority of his career in the applications group. He was instrumental in the development of heavy ribbon bonding and the early stages of small and heavy copper wire bonding development. From there, Kristian moved on to the Process and Ultrasonic Group where he advanced to Ultrasonics Group Manager, successfully leading a team of engineers in the development of new ultrasonic transducer products.

Kristian will be based out of Orange County, California and will focus on supporting sales of the company’s wire bonding equipment and services, in addition to advanced wire bonding process development. Kristian holds a degree in Mechanical Engineering from California Polytecnic State University.

“Kristian brings a wealth of experience in wire bonding processes and development to Hesse Mechatronics”, said Michael McKeown, Senior Business Development Manager. “We are very pleased to have him joining the team at Hesse Mechatronics”.

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com.  For more information on Hesse Mechatronics’ training and applications support services, please e-mail info@hesse-mechatronics.us. To see wire bonding in action, visit www.wirebonddemo.com.

About Hesse Mechatronics

Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

For more information, please visit the company’s website at www.hesse-mechatronics.com.

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