News

Four Hesse Mechatronics labs focused on wire bonding process technology now open across the country   Fremont, CA, August 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently opened its newest training andRead the full article…

Hesse Mechatronics to introduce and demo the new Bondjet BJ931L — ideal for lead frame power semiconductor packages — to attendees at SEMICON West Fremont, CA, June 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductorRead the full article…

Hesse Mechatronics’ West Coast Demo and Applications LabAdds Heavy Wire and Ribbon Bonding Equipment, Prototyping and R&D   Fremont, CA, April 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces thatRead the full article…

Fremont, CA, April 9, 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in theRead the full article…

Heavy Wire Bonder Features Support Power Electronics Requirements Fremont, CA, February 13, 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will demo its next generation BONDJET BJ93X Heavy Wire Bonder in BOOTHRead the full article…

The HBK08 Bondhead supports special loop formations, fine pitch and multi-stitch bonding Fremont, Calif., Aug 2012 – Hesse, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 andRead the full article…