San Jose, Calif., June 2011 – Hesse Mechatronics, Inc., a subsidiary of Hesse GmbH – leading manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry – will give a technical presentation on wire bonding at the IMAPS ATW on High Reliability Microelectronics for Medical and Hi-Rel Devices taking place June 14-15,Read the full article…
WireBondDemo.com
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Hesse GmbH International
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