Fremont, CA, January 16, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will discuss “Wedge Bonding for RF and Microwave Devices” at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging to be held February 7-8, 2012 in San Diego, CA.

RF and Microwave device interconnection requires demanding capabilities only wedge bonding can provide. Flat, extremely low loop shape, constant wire length and ribbon bonding are standard wedge bonding capabilities that cannot be produced by ball bonders. For high frequency electrical signals, conduction occurs in the “skin,” or outer 0.5µm of the wire cross-section. Ribbon wire has a much larger “skin” than round wire; thus, it is often required for RF and microwave devices. In addition, many high-speed devices require flat, short loops of the same wire length to match inductances of signals for proper performance.

The Hesse technical presentation will provide an overview of how the latest wedge bonding equipment meets the highest demands of these RF and microwave devices, improving productivity and device quality.

A flexible wire clamp design on wedge bonding equipment enables both round and ribbon wire to be easily interchanged on the same bond head. The bond wedge feeds the wire from behind and under the face of the tool, naturally producing low loop heights.

Enhanced user-friendly software enables easy programming of low, stress-free loops, specification of constant wire length or constant loop height and precise control of ribbon deformation down to 1/4 mil. Enhanced tear routines also allow reverse bonding over raised structures (air bridges) on MEMS, RF and microwave devices. Advanced wedge bonders can also display looping profiles to aid in achieving the best electrical device performances.

Wedge bonders are noted for their greater flexibility on difficult to bond surfaces. Soft touchdown and multiple defined bonding interval profiles are used to successfully bond challenging RF materials such as GaAs and Duroid. The S-shape bond feature allows the user to stack bonds or in some cases place two bonds on the same pad and fan the second bonds to different locations.

For more information on this presentation, visit http://www.imaps.org/rf/index.htm. For more information on wedge bonders, please visit the company’s website at www.hesse-Mechatronics.com.

About Hesse Mechatronics
Hesse GmbH, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

For more information, please visit the company’s website at www.hesse-Mechatronics.com.