High Current Ribbon (HCR™) Bonding

The Bondjet BJ935 heavy wire bonder demonstrates high power ribbon bonding capability with a large bonding area of 13.8″ x 19.7″ (350 mm x 500 mm) and 2” (50 mm) Z-travel capability. The heavy wire bonder handles Al, Au and Cu (aluminum, gold and copper) round wire or ribbon wire – round wire 100 μm up to 500 μm (4 mil up to 20 mil) and ribbon wire 0.075 mm x 0.75 mm up to 0.3 mm x 2 mm.