Wire Bonding Step and Repeat

This video demonstrates wire bonding of a 175 die matrix utilizing the wire bonding step and repeat programming function on the Bondjet BJ820.

The Bondjet BJ820 offers a large, flexible bonding area of 12” x 16.1” (305 mm x 410 mm) that can serve two or more smaller substrates or enable intelligent automation of extra large products. Indexing time is eliminated and throughput is maximized for your wire bonding production.